Hengge 12-Inch Wafer-Level Microwave Plasma Resist Stripping and Surface Treatment Equipment Shipped Smoothly
On March 20, Hengge successfully shipped a 12-inch wafer-level microwave plasma resist stripping and surface treatment equipment to a benchmark enterprise in the field of semiconductor advanced packaging and testing. This milestone event marks a solid step for the company in the field of high-end semiconductor equipment manufacturing.
The 12-inch wafer-level microwave plasma resist stripping and surface treatment equipment, jointly developed by Hengge and the National Laboratory of the University of Electronic Science and Technology of China (UESTC), has been shipped smoothly
Introduction to Hengge 12-Inch Wafer-Level Microwave Plasma Resist Stripping and Surface Treatment Equipment
Process Features
Used for removing various photoresists and resin layers in wafer production and advanced packaging fields, as well as surface modification in fields such as wafer-level packaging, integrated circuits, discrete devices, and compounds.
Performance Parameters
Equipment Dimensions:
2845mm(W)*3568mm(D)*2100mm(H)
Wafer Loading Size:
Standard 12-inch wafers, compatible with 8-inch wafers, ultra-thin wafers, transparent wafers, etc.
Upper microwave, lower RF process
Low-temperature surface treatment process, high-temperature resist stripping process
Equipment Advantages
High Adaptability and Customization: Compatible with standard 12-inch wafers, as well as 8-inch wafers, ultra-thin wafers, transparent wafers, etc.
High Uniformity and Etch Rate: Both stable performance and high efficiency
Low Operating Cost and Small Footprint: The equipment is highly integrated, and relying on advanced intelligent technology, it achieves excellent results with low operating costs
Easy Operation and Maintenance: Minimalist operation interface, no complex operation instructions required; unique design makes maintenance simple and convenient
Future Outlook of Hengge
Looking forward to the future, Hengge will unswervingly take technological innovation as its core driving force. It will actively deploy in emerging technology fields of semiconductor equipment, open up new paths for the intelligent upgrading of equipment, support the clustered development of the domestic semiconductor industry, and continue to contribute to the prosperity and development of China's semiconductor industry.
