Main Unit Dimensions: Length 1860mm / Width 1470mm / Height 2100mm
Weight: 2550 KG
Number of Electrodes: 16 Pieces
Main Unit Dimensions: Length 1980mm / Width 1470mm / Height 2100mm
Weight: 2700 KG
Number of Electrodes: 19 Pieces
Main Unit Dimensions: Length 2010mm / Width 1470mm / Height 2100mm
Weight: 2800 KG
Number of Electrodes: 21 Pieces
Main Unit Dimensions: Length 2275mm / Width 1670mm / Height 2770mm
Weight: 3000 KG
Number of Electrodes: 25 Pieces
Main Unit Dimensions: Length 1895mm / Width 1668mm / Height 2140mm
Weight: 2850 KG
Number of Electrodes: 16 Pieces
Main Unit Dimensions: Length 2100mm / Width 1730mm / Height 2200mm
Weight: 3050 KG
Number of Electrodes: 19 Pieces
Main Unit Dimensions: Length 2220mm / Width 1765mm / Height 2200mm
Weight: 3200 KG
Number of Electrodes: 21 Pieces
Main Unit Dimensions: Length 2894mm / Width 1892mm / Height 2892mm
Weight: 3500 KG
Number of Electrodes: 25 Pieces
- Modification of PTFE Materials for High-Frequency PCBs to Improve Hydrophilicity and Reduce Hole Voids
- Removal of Hole Residue in High-Tg, High-Aspect-Ratio, and High-Multilayer PCBs to Enhance the Reliability of Inner-Layer Connections
- Removal of Residual Film from Dry Film and Ink on Ultra-Fine Circuits of Substrates After Development to Improve Qualification Rate
- Removal of Carbon Residue by Laser Drilling to Enhance the Reliability of Hole Connections
- Removal of Hole Residue in Rigid-Flex PCBs to Improve the Etching Consistency of Rigid and Flexible Materials and Enhance Hole Wall Quality
- Roughening of Flexible Materials for Rigid-Flex PCBs Before Lamination to Improve Lamination Bonding Strength
- Pretreatment of Precious Metals to Remove Surface Oil and Grease and Improve Qualification Rate
- Removal of Surface Oxidation and Activation of BGA and Gold Fingers to Enhance Metal Sputtering/Solderability
The chamber is made of aviation-grade aluminum alloy with seamless welding, and the vacuum leakage rate is less than 10 mt/min, which better ensures the etching rate and uniformity.
The electrode adopts an integrated forming process (seamless welding) and a unique air inlet and exhaust method, resulting in better ionization effect.
The electrode heating efficiency is increased by 20%, and the etching uniformity is excellent.
Meanwhile, an optional electrode constant temperature system is available, which can reduce the heating time by 50%.
The etching rate is 15-20% faster than that of imported brands and 35-40% faster than that of other domestic brands.