Wafer Manufacturing / Various Chip Processing Fields:
After etching or ion implantation, it is necessary to remove the photoresist, or perform surface Descum after photolithography.
Wafer-Level Packaging (WLP) Field:
Applications include removal of surface photoresist and resin-based materials; cleaning of holes before electroplating; modification of surface adhesion; modification of surface roughness; modification of hydrophilic and hydrophobic layers; modification of passivation layers; and reduction of CuO.
- Removal of Various Photoresists and Resin Layers in Wafer Production and Advanced Packaging Fields, as well as Surface Modification in Fields such as Wafer-Level Packaging, Integrated Circuits, Discrete Devices, and Compounds
Equipment Dimensions: 2845mm (W) * 3568mm (D) * 2100mm (H)
Wafer Loading Size: Standard 12-inch wafers, compatible with 8-inch wafers, ultra-thin wafers, transparent wafers, etc.
Upper microwave, lower RF process
Low-temperature surface treatment process, high-temperature resist stripping process