Microwave Plasma Etching Cleaning Machine
Model:PWM-2016A
Main Unit Dimensions: 2411mm (Length) * 1560mm (Width) * 1995mm (Height)
Installation Area: 3000mm (Length) * 3500mm (Width) (including positions for vacuum pump and chiller)
Maximum Size of Production Board: 600*580mm
Main features
Microwave plasma has a higher density compared to radio frequency inductively coupled plasma (ICP)
Suitable for processes requiring high etching rates in resins
Low self-bias voltage, with minimal ion sputtering and implantation effects
Suitable for resin etching of embedded chips in MEMS manufacturing and advanced semiconductor packaging
Due to volumetric heating, the density is extremely uniform, enabling excellent overall etching uniformity