Asher/Descum(Dual Chamber)
Model:PSSD2000
Main Application Scenarios:
Wafer Manufacturing / Various Chip Processing Fields:
After etching or ion implantation, it is necessary to remove the photoresist, or perform surface Descum after photolithography.
Wafer-Level Packaging (WLP) Field:
Applications include removal of surface photoresist and resin-based materials; cleaning of holes before electroplating; modification of surface adhesion; modification of surface roughness; modification of hydrophilic layers; modification of passivation layers; and reduction of CuO.
Scope of application
- Photoresist removal and surface treatment in various processes such as front-end and back-end wafer processing, advanced packaging, and MEMS; Descum process applicable to standard 8-inch, 6-inch, 4-inch wafers, thin wafers, and special process wafers like Si, SOI, GaN, and SiC
Main features
Dual-chamber and dual-stage design to increase throughput
High-temperature/ultra-low-temperature processes
High etching rate and excellent uniformity
Excellent Descum performance
Minimal substrate damage