AI-Specific Plasma Etching Cleaning Machine
Model:PE21-3052
Intelligently monitors and adjusts core parameters with high precision
Reads and dynamically adjusts equipment operation
Scope of application
- Hole residue removal for high-aspect-ratio (50:1) high-multilayer PCBs used in AI servers, enhancing the reliability of inner-layer connections; positive undercut controllable at 4-13μm, TP value controllable at 60%-80%
- Carbon residue removal by laser drilling, capable of processing minimum hole diameter of 35μm, improving the reliability of hole connections
- Modification of PTFE (Teflon), carbon black, and PI materials for high-frequency PCBs to improve hydrophilicity and reduce hole voids
- Residual film removal from dry film and ink on ultra-fine circuits of substrates after development
- Hole residue removal in rigid-flex PCBs to improve the etching consistency of rigid and flexible materials and enhance hole wall quality
- Roughening of flexible materials for rigid-flex PCBs before lamination to improve lamination bonding strength
- Pretreatment of precious metals to remove surface oil and grease
Advantage
Etching rate
0.05-0.1 mg/min
High Aspect Ratio: TP Value
60%-80%
Uniformity of glue removal/Temperature uniformity
Resist stripping uniformity: 80%-90%
Temperature uniformity: 90%-95%
