12-inch Plasma Asher and descum
Model:PSLD3000
Wafer Manufacturing / Various Chip Processing Fields:
After etching or ion implantation, it is necessary to remove the photoresist, or perform surface Descum after photolithography.
Wafer-Level Packaging (WLP) Field:
Applications include removal of surface photoresist and resin-based materials; cleaning of holes before electroplating; modification of surface adhesion; modification of surface roughness; modification of hydrophilic and hydrophobic layers; modification of passivation layers; and reduction of CuO.
Scope of application
- Removal of various photoresists and resin layers in wafer production and advanced packaging fields, as well as surface modification in fields such as wafer-level packaging, integrated circuits, discrete devices, and compounds
Main features
- Equipment Dimensions: 2845mm (W) * 3568mm (D) * 2100mm (H)
Wafer Loading Size: Standard 12-inch wafers, compatible with 8-inch wafers, ultra-thin wafers, transparent wafers, etc.
Upper microwave, lower RF process
Low-temperature surface treatment process, high-temperature resist stripping process