Inline Vacuum Plasma Cleaning Equipment
Model:HG2302
The machine is a standalone placement machine.
Manual loading and unloading.
Scope of application
- Removal of various photoresists and resin layers in wafer production and advanced packaging fields, as well as surface modification in fields such as wafer-level packaging, integrated circuits, discrete devices, and compounds
Main features
Compatible size specifications for inline plasma processing system:
max: 20090mm (lengthwidth) Min: 10040mm (lengthwidth)
Product jigs can be designed in multiple layers according to customer needs, capable of processing 4 pieces at one time.
Material switching can be achieved by simply adjusting the recipe without the need to adjust the jig!
Moving components all adopt servo motors + modules to achieve high-precision processing.
Equipped with PLC+HMI control system for fully automatic control.