Horizontal Plasma Etching Cleaning Machine
Model:PH16-2842
Main Unit Dimensions: Length 2050mm / Width 1485mm / Height 1900mm
Weight: 2050 KG
Number of Electrodes: 16 Pieces
Scope of application
- Remove glue residue from the holes of double-sided boards and multi-layer boards
- The inner layer PI film is roughened to enhance the bonding strength during lamination, increasing the pull force value by more than 10 times
- Pre-treatment cleaning for ENIG, ENEPIG, and electroplated nickel gold to eliminate BGA and gold finger plating defects
- Cleaning contaminants (e.g., oxidation on gold fingers, resin bleed from laminated protective films) during LCD module board processing
- Surface roughening of stiffener materials (FR-4, steel sheets, aluminum sheets) to enhance bonding strength with flexible circuits