On July 14, the ceremony for Zhuhai Hengge Microelectronics Equipment Co., Ltd. to deliver semiconductor deep trench etching equipment to the School of Integrated Circuit Science and Engineering of the University of Electronic Science and Technology of China (UESTC) was grandly held at the Qingshuihe Campus.
Under the national strategic layout of the integrated circuit industry, as a core equipment supplier, Hengge has assisted the first batch of key universities in building an integrated circuit teaching and experimental production line system. This marks the official realization of a full-chain connection from theoretical teaching to practical application in the cultivation of high-end chip talents in China.
Visiting the National Integrated Circuit Industry-Education Integration Innovation Platform
At the beginning of the event, the participating guests jointly visited the National Integrated Circuit Industry-Education Integration Innovation Platform. As an important carrier of the National Key Laboratory of Electronic Thin Films and Integrated Devices, this platform has built a full-process teaching and research production line covering chip design, manufacturing and testing.
Speech by Professor Yang Xiaobo, Former Vice President
In his speech, Professor Yang Xiaobo, former vice president, highly praised Hengge Microelectronics' breakthroughs in the field of semiconductor equipment. He pointed out that the deep trench etching equipment delivered this time will significantly enhance the college's practical teaching capabilities and promote the full-chain talent training of "theory-practice-innovation".
University-Enterprise Collaboration to Create a "Chip" Pattern
Alumnus Li Zhiqiang, General Manager of Hengge Microelectronics, revealed in his keynote report "University-Enterprise Cooperation to Promote Hengge's Development" that this plasma etching equipment is a representative independently developed product of the company. It has broken through a number of industry technical bottlenecks and can be compatible with the manufacturing needs of 8-12 inch wafers.
It is worth mentioning that most of the core members of Hengge's R&D team are graduates of UESTC. The Plasma Equipment and Application Technology Research Center jointly established by the two parties has become an important support for technological innovation.
Equipment Delivery Opens a New Chapter
Secretary Li Xuemei of the School of Integrated Circuit emphasized in her speech that this equipment will be directly used in the construction of the National Integrated Circuit Industry-Education Integration Innovation Platform. It will help break through the "chokepoint" technologies in high-end chip manufacturing and provide solid support for cultivating outstanding engineers in the "chip" era.
Jointly Drafting the Blueprint of "China Chip"
Hengge Microelectronics stated that it will continue to deepen the industry-university-research cooperation with the school. When youth meets the "chip" era, we look forward to more students taking on responsibilities in overcoming "chokepoint" technologies! We will jointly promote the R&D of core technologies in semiconductor equipment.
At the end of the ceremony, all participants took a group photo, and the camera froze this vivid practice of "alumni giving back to their alma mater and industry empowering education".
